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16th IEEE European Test Symposium
Vendor Sessions
(ETS 2011)

May 23-27, 2011
Trondheim, Norway

http://www.ieee-ets.org/

CALL FOR SUBMISSIONS
Scope -- Submissions -- Key Dates -- Corporate Support -- Additional Information

Scope

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, practical applications, hot topics, and new trends in the area of electronic-based circuit and system testing.

In 2011 ETS will take place in Trondheim, Norway and is being organized by the Norwegian University of Science and Technology (NTNU) and sponsored by the Test Technology Technical Council (TTTC) of the IEEE Computer Society. Norway is known for its white summer nights; during the week of ETS’11 the sun will rise in Trondheim well before 4am and set close to 11pm.

ETS’11 is offering commercial vendors the opportunity to give technical presentations in a track parallel to the technical paper sessions. These presentations will be listed in the symposium program along with the technical sessions, and should be targeted to the ETS technical audience. The Vendor Sessions differ from other ETS presentations in that company names, logos, and product names may be mentioned explicitly. Typical content includes product descriptions, case studies, best practices, and user testimonials.

Presentation opportunities of 30-minute duration are available on a first-come first-served basis, but priority will be given to those companies that are also corporate supporters of ETS’11 – see below. Attendance at the sessions is open to all symposium attendees, and vendor representatives will be able to hand out literature at the session. Proposals for the Vendor Sessions should be technical or application focused, rather than overtly sales-and-marketing focused. Proposal selection is based on the technical content and relevance to ETS’11 audience and topics. The areas of interest of ETS’11 include (but are not limited to) the following topics:

  • Analog Test
  • ATE Hardware and Software
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self Test (BIST)
  • Current-Based Test
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability
  • Design for Test(ability) (DfT)
  • Design Verification and Validation
  • Diagnosis and Debug
  • Economics of Test
  • Failure Analysis
  • Fault Modelling and Simulation
  • Fault Tolerance
  • High-Speed I/O Test
  • Memory Test and Repair
  • Microprocessor Test
  • Mixed-Signal Test
  • MEMS Test
  • Nanotechnology Test
  • On-Line Test
  • Power Issues in Test
  • Reliability
  • RF Test
  • Self-Repair
  • Signal Integrity Test
  • Standards in Test
  • Stacked IC Test
  • System Test
  • System-in-Package (SiP) Test
  • System-on-Chip (SoC) Test
  • Test(ability) Synthesis
  • Test of Reconfigurable Systems
  • Test Quality
  • Thermal Issues in Test
  • Yield Analysis and Enhancement

 

Submissions

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A submission to the ETS’11 Vendor Sessions can be an abstract, extended abstract or full paper (max. six pages); submission of a full paper is preferred, but not required. Proposals should be submitted via the ETS’11 website; detailed submissions instructions can also be found there (go to http://www.ieee-ets.org, follow the link to ETS’11, and then select Submission Instructions).

Key Dates

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Submission deadline (for Vendor Sessions only): January 28, 2011
Notification of acceptance: February 15, 2011
Final copy deadline: March 15, 2011

Corporate Support

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Every year, ETS is financially supported by several companies. The support money is used to reduce the registration fees and hence make the event more accessible to all its attendees. In return, the corporate supporters are allowed to make publicity in various ways. ETS has defined four different support grades (Bronze, Silver, Gold, and Platinum), each with different support amounts and publicity options. To find out more, contact Erik Jan Marinissen or Knut Båtstoløkken, details below.

Additional Information
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Erik Jan Marinissen ETS’11 Industrial-Relations Chair
Phone: +32 16 288-755 / +32 479 977-704
E-mail: erik.jan.marinissen@imec.be

Knut Båtstoløkken – ETS’11 Industrial-Relations Vice-Chair
Phone: +47 37 07 16 07 / +47 928 53 829

E-mail: knut.baatstoloekken@kitron.com


For more information, visit us on the web at: http://www.iet.ntnu.no/workshop/ets2011/

The 16th IEEE European Test Symposium (ETS'11) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 1ST VICE CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Gordon W. ROBERTS
McGill University
- Canada
Tel. +1-514-398-6029
E-mail gordon.roberts@mcgill.ca

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic Corporation - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it

 

PRESIDENT OF BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

SENIOR PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 2ND VICE CHAIR
Chen-Huan CHIANG

Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

FINANCE
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

IEEE DESIGN & TEST EIC
K.T. (Tim) CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39-011-564-7055
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
STARC - Japan
Tel. +
E-mail hatayama.kazumi@starc.or.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
William R. MANN
SW Test Workshop - USA
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com